发明名称 WHITE CURABLE COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, AND MOLDING FOR OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a white curable composition for an optical semiconductor device, wherein an optical semiconductor device using the white curable composition has luminosity that is hardly degraded even if being energized in high temperature and high humidity.SOLUTION: A white curable composition for a semiconductor device contains an epoxy compound having an epoxy group, an acid anhydride curing agent, titanium oxide, and a filler different from titanium oxide. The epoxy compound has no aromatic skeleton. Atoms constituting the epoxy compound are only three kinds of a carbon atom, an oxygen atom and a hydrogen atom.
申请公布号 JP2013209531(A) 申请公布日期 2013.10.10
申请号 JP20120081009 申请日期 2012.03.30
申请人 SEKISUI CHEM CO LTD 发明人 SHIKAGE TAKASHI;HIGUCHI ISAO;FUKUDA TAKASHI;YASUI HIDEFUMI;NAKAMURA HIDE;WATANABE TAKASHI
分类号 C08G59/24;C08K3/00;C08K3/22;C08L63/00;H01L23/02;H01L23/29;H01L23/31;H01L33/56 主分类号 C08G59/24
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