| 摘要 |
PROBLEM TO BE SOLVED: To form via conductors in areas located immediately above through holes without adding a special process for burying the interior of the through holes.SOLUTION: A multilayer wiring board 1 includes: a build up layer 3 and a build up layer 4, each of which is formed by laminating at least one insulation layer and at least one conductor layer; a support substrate 21 supporting the build up layers 3, 4 on an upper surface and a lower surface; through holes 24 that are formed extending in a direction that leads from the upper surface side to the lower surface side of the support substrate 21; through hole conductors 25 that are formed on inner peripheral surfaces of the through holes 24; conductor layers 22, each of which is formed so as to cover an upper surface side opening 241 of the through hole 24 and is electrically connected with the through hole conductor 25; and conductor layers 23, each of which does not cover a lower surface side opening 242 of the through hole 24, each of the conductor layers 23 formed around the opening 242 and electrically connected with the through hole conductor 25. |
