| 摘要 |
PROBLEM TO BE SOLVED: To perform an inspection with high efficiency while preventing a substrate with bumps, which should pass the inspection originally, from being rejected.SOLUTION: Based on a shape of ring-like reflection light of bumps by ring-like illumination from an upper side of the bumps, all bump heights are measured to determine the success/failure of a substrate with the bumps (S1, S2). All bumps of the substrate with bumps which is determined as a success are irradiated with scan light from an inclining direction and based on positions from reflection light from bump tops and reflection light from bump bottoms, the heights of all the bumps are measured to determine the success/failure of the substrate with bumps (S3, S5). Regarding the rejected substrate with bumps, from a relational expression about a relation of a diameter of the ring-shaped reflection light of the bumps not suited to a predetermined height reference, the diameter of the ring-shaped reflection light of the bumps obtained from the actual measurement beforehand and the bump heights, compensation is performed to estimate whether the rejected bump has a predetermined height (S7) and while considering the estimation, the success/failure of the substrate with the bumps is determined (S7). |
