| 摘要 |
Provided is an adhesive sheet which reduces deficient adhesion to semiconductor wafers by effectively suppressing voids from occurring between an adhesive layer and an adhesive film. This adhesive sheet wound into a roll shape comprises a rectangular release film, an adhesive layer provided in a label form on the release film, and an adhesive film comprising a label part which covers the adhesive layer and contacts the release film in the periphery of the adhesive layer, and a peripheral part which surrounds the outer side of the label part, wherein through-holes passing through the adhesive film are provided outside of the portion of the adhesive layer corresponding to an adherend-foreseen portion and inside of the label part, and, for one label portion of the adhesive film, the adhesive layer outer circumference × 1/43 @ maximum width of the through-holes × number of holes @ adhesive layer outer circumference. |
