| 摘要 |
PURPOSE: A manufacturing method capable of obtaining a conductive metal powder is provided to be widely utilized in the field of information technology (IT) as well as in the field of soldering and in a conductive paste which uses a tin powder coated on the surface of a metal powder. CONSTITUTION: A manufacturing method capable of obtaining a conductive metal powder comprises the following steps. Oxides or impurities which exist on the surface of a metal powder are removed to provide excellent adhesive power and smoothness to a coated object. The metal powder is injected into a plating bath. Tin is coated by reducing the surface of a metal powder material, which is injected into the plating bath, to tin salt which is included in a plating solution. A solvent is used for a washing process to remove a byproduct except the tin (Sn) which is coated on the material surface. A drying process is performed to remove the solvent. |
