| 摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of a failure of an electronic component built in a multilayer wiring board.SOLUTION: A method for manufacturing a multilayer wiring board comprises the steps of: forming a laminate in which insulating layers (21, 22) and conductor layers (12, 13) are alternately laminated, on a support substrate (60); storing a semiconductor chip (50) in an opening (641) of a prepreg (64) which is formed on a surface of the laminate and has sheet-like glass fibers impregnated with a resin; and heating and pressurizing a surface of the prepreg (64) in a state where the semiconductor chip (50) is stored in the opening (641). |
