发明名称 ELECTRONIC COMPONENT TO BE BUILT IN PRINTED WIRING BOARD AND MANUFACTURING METHOD OF COMPONENT BUILT-IN PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a component built-in printed wiring board having high long term reliability, in which a chip component can be held surely without increasing the manufacturing cost.SOLUTION: The electronic component to be built in a printed wiring board, in which the surface of an electrode terminal is formed of copper and the electrode terminal is coated with resin, is manufactured. A hole is formed in an organic resin substrate added with a glass material, and the electronic component to be built in a printed wiring board is inserted into the hole. Subsequently, a prepreg of semi-cured resin is hot pressed and hardened thus holding the electronic component to be built in a printed wiring board surely, without causing poor adhesion to the prepreg due to oxidation of the electrode terminal.
申请公布号 JP2013211431(A) 申请公布日期 2013.10.10
申请号 JP20120081079 申请日期 2012.03.30
申请人 NEC TOPPAN CIRCUIT SOLUTIONS INC 发明人 SHIMA TOSHIYUKI;KAMATA MITSUAKI
分类号 H05K3/46;H01G4/12;H05K3/00 主分类号 H05K3/46
代理机构 代理人
主权项
地址