CIRCUIT BOARD HAVING ELECTRODEPOSITED COATING ON CONDUCTIVE CORE IN VIA AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a circuit board having an electrodeposited coating on a conductive core in a via, and a method for manufacturing the same.SOLUTION: A process for manufacturing a circuit board includes the steps of: providing a substrate including a first conductive core 12 having a first insulating coating 14 on a first side surface and a second insulating coating 16 on a second side surface; forming an opening 22 in the first insulating coating, the second insulating coating, and the first conductive core; exposing an edge of the conductive core in the opening; and electrodepositing a third insulating material 28 on an exposed edge of the first conductive core. There is also provided a circuit board 10 manufactured using the process.