SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can obtain high reliability.SOLUTION: A semiconductor device manufacturing method comprises: a process of forming a foundation layer 28a by a lift-off method; a process of providing a metal layer 29 on a whole surface including the foundation layer 28a; a process of forming a mask 36 including a pattern which covers the foundation layer 28a on the metal layer 29 and forming an Au layer 28b by etching the metal layer 29; a process of providing on the Au layer 28b, an insulation film 22 having a level difference 22a which reflects a level difference 28d formed by the Au layer 28b; and a process of providing a metal layer 30 at a position which covers the level difference 22a of the insulation film 22.