DRIVER

摘要

PROBLEM TO BE SOLVED: To prevent a voltage drop by a wiring layer in a semiconductor integrated circuit device even when the number of output terminals of a driver is increased.SOLUTION: The driver comprises: a film substrate on which a first wiring layer and a second wiring layer are formed; and a semiconductor chip mounted on the film substrate by a chip-on film method. The first wiring layer is connected to an input terminal formed on an outer periphery of the film substrate, and the second wiring layer is connected among a plurality of terminals of the semiconductor chip. The first wiring layer and the second wiring layer are connected to each other. Power for the semiconductor chip or clock is transmitted via the first wiring layer and the second wiring layer, and the second wiring layer is formed between the semiconductor chip and the film substrate.