发明名称 Structure and Method for Placement, Sizing and Shaping of Dummy Structures
摘要 A chip includes a number a plurality of functional areas of a layer and a number of dummy structures within the layer. The dummy structures are spaced from the functional areas. Each dummy structure has a size that is a function of the size and density of the functional areas.
申请公布号 US2013267048(A1) 申请公布日期 2013.10.10
申请号 US201313907449 申请日期 2013.05.31
申请人 INFINEON TECHOLOGIES AG 发明人 SCHMIDT SEBASTIAN;SCHAFBAUER THOMAS;LIU HANG YIP;WEI YAYI
分类号 H01L21/66;G06F17/50;H01L21/027;H01L21/3105;H01L21/321;H01L21/762;H01L21/82 主分类号 H01L21/66
代理机构 代理人
主权项
地址