发明名称 METHOD FOR MEASURING A MICROELECTROMECHANICAL SEMICONDUCTOR COMPONENT
摘要 The invention relates to a method for checking a pressure sensor comprising a reversibly deformable, in particular reversibly bendable measuring element (18) which supplies a measurement signal having a value depending on the degree of deformation of said measuring element, to the effect of whether the pressure sensor withstands a required maximum pressure which is larger by a predeterminable factor than a nominal pressure for which the sensor is designed. The method comprises providing a reference pressure sensor which is structurally identical to the pressure sensor to be checked and which has a reversibly deformable, in particular reversibly bendable measuring element (18) which supplies a measurement signal having a value depending on the degree of deformation of said measuring element, wherein up to a predetermined degree of a reversible deformation of the measuring element (18) the dependence of the value of the measurement signal on the reversible deformation of the measuring element (18) is known as a distance/pressure characteristic curve, and wherein the critical pressure required for breaking the measuring element (18) is larger than the required maximum pressure that the pressure sensor to, be checked is intended to withstand. A deflection plunger (32) that can be advanced in a distance-controlled manner is provided, wherein the deflection plunger (32) with the exception of the reference pressure sensor or a pressure sensor to be checked is free of a sensor operatively connected thereto for determining the force respectively required for advancing the deflection plunger (32). The deflection plunger (32) is brought into contact with the measuring element (18) of the reference pressure sensor and is subsequently advanced in a distance-controlled manner with reversible deformation of the measuring element (18). The measuring element (18) is increasingly deformed by the deflection plunger (32) advanced in a distance-controlled manner until the measuring element (18) breaks. The measurement signals supplied by the measuring element (18) during increasing deformation thereof are detected. The distance covered by the deflection plunger (32) from the beginning of the reversible deformation of the measuring element (18) up to breakage of the measuring element (18) is determined. The value of the measurement signal upon maximum reversible deformation of the measuring element (18), without the latter having been broken, is determined as a critical measurement signal. The value of the critical pressure corresponding to the critical measurement signal or the value of a parameter representing said pressure is determined on the basis of the known distance/pressure characteristic curve of the reference pressure sensor. The measuring element (18) of at least one pressure sensor to be checked is reversibly deformed up to a predeterminable degree by means of the deflection plunger (32) advanced in a distance-controlled manner and its distance/pressure characteristic curve is created. A comparison of the created distance/pressure characteristic curve of the pressure sensor to be checked with the known pressure/distance characteristic curve of the reference pressure sensor is used as a basis for identifying whether the measuring element (18) of the pressure sensor to be checked withstands the required maximum pressure or would break or would already have been broken at said pressure.
申请公布号 US2013263643(A1) 申请公布日期 2013.10.10
申请号 US201113990337 申请日期 2011.12.05
申请人 BINKHOFF PETER;ELMOS SEMICONDUCTOR AG 发明人 BINKHOFF PETER
分类号 G01L9/00;G01L27/00 主分类号 G01L9/00
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