| 摘要 |
This semiconductor laser apparatus has a conductive heat dissipating member, a conductive first adhesive, and a semiconductor laser element. The first adhesive is provided on the heat dissipating member, and the semiconductor laser element is provided on the first adhesive. Under the emitter end surface portion of the semiconductor laser element, said emitter end surface portion having laser light emitted therefrom, the first adhesive reaches a portion on the side surface of the heat dissipating member. Consequently, heat dissipating characteristics of the semiconductor laser element can be further improved, and laser light emitted from the semiconductor laser element can be efficiently extracted. |
