| 摘要 |
A semiconductor device (10) according to one embodiment of the present invention is provided with a chip mounting substrate (12), a first semiconductor chip (20a) that is mounted on the chip mounting substrate, and a second semiconductor chip (20b) that is adjacent to the first semiconductor chip and mounted on the chip mounting substrate. The chip mounting substrate has a first surface (34a), on which the first semiconductor chip is mounted, and a second surface (36a), on which the second semiconductor chip is mounted. The position of the second surface is different from the position of the first surface in the thickness direction of the chip mounting substrate. |
