SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof provide precise through wiring with low defects by forming the through wiring using a protrusion part formed from a conductive member. CONSTITUTION: A plane part and a protrusion part are formed by removing a partial area of a conductive member. A semiconductor chip (120) and a sealing member (130) sealing the conductive member are formed. Through wiring (110) is formed by exposing the protrusion part of the conductive member from the sealing member. A rewiring pattern layer (140) electrically connected to the through wiring and the semiconductor chip is formed. An external connection member (150) electrically connected to the rewiring pattern layer is formed.