| 摘要 |
PROBLEM TO BE SOLVED: To fill a resin into a space between an electronic component and wiring making an electric connection for the electric component so as to avoid voids without depending on the sizes of pitches of electrode terminals that connect the electronic component with the wiring, such as solder balls and pins, and the sizes of gaps between the electronic component and the wiring in a component built-in wiring board incorporating the electronic component in an insulation member.SOLUTION: A groove is formed so as to communicate with an opening of a second wiring layer in a region positioned immediately below an electronic component on a first insulation layer positioned below the second wiring layer on which an electronic component is mounted. A resin is poured into a gap between the electronic component and the second wiring layer with the groove used as a guide groove. |
