发明名称 VACUUM DEPOSITION DEVICE AND VACUUM DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To enable high-speed deposition even when performing vapor deposition of a material susceptible to degradation caused by heat load, such as an organic material, when performing vapor deposition using an evaporation source on a large-size substrate which is upright arranged in a vacuum deposition chamber.SOLUTION: A vacuum deposition device 100 includes a vapor deposition chamber 5 comprising a vacuum vessel, and an evaporation source 31 for forming a vapor deposition film on a substrate 1. The evaporation source includes an evaporation chamber 22 which stores a vapor deposition material and a nozzle 21 which injects the vapor deposition material evaporated in the evaporation chamber to the substrate. A material hopper chamber 11, which stores the vapor deposition material to be delivered to the evaporation chamber, is provided in the vapor deposition chamber, and a carrying means 68 of the vapor deposition material, which can carry the vapor deposition material 4 stored in the material hopper chamber, is attached to the material hopper chamber. The carrying means of the vapor deposition material includes an insulating member 62 at the end thereof.
申请公布号 JP2013209699(A) 申请公布日期 2013.10.10
申请号 JP20120079802 申请日期 2012.03.30
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 MIYAKE TATSUYA;MATSUURA HIROYASU;MINEKAWA HIDEAKI;YAZAKI AKIO;OGATA TOMOHIKO;YAMAMOTO KENICHI;KUSUNOKI TOSHIAKI;TAMAKOSHI TAKESHI
分类号 C23C14/24;H01L51/50;H05B33/10;H05B33/26 主分类号 C23C14/24
代理机构 代理人
主权项
地址