发明名称 METHOD FOR SELECTIVE LASER SINTERING AND SYSTEM FOR SELECTIVE LASER SINTERING SUITABLE FOR SAID METHOD
摘要 A method and a device perform selective laser sintering. In the method for laser sintering, energy is applied linearly to a cross-sectional surface of the component to be produced in order to compact the powdery material. In the case of components with cross-sectional surfaces that have a curved contour, the application of energy can be guided in a line-shaped manner following the curved contour so that the contour of the workpiece that develops is continuously replicated. Advantageously, irregularities in the contour, which are caused by the raster predetermined by the laser sintering method, can thus be largely avoided. The device for laser sintering includes a powder delivery unit which can rotate about a rotational axis located in the interior of an annularly closed cross-section of the workpiece to be produced.)
申请公布号 US2013264750(A1) 申请公布日期 2013.10.10
申请号 US201113825893 申请日期 2011.09.22
申请人 HOFACKER OLIVER;SCHAEFER MARTIN;SIEMENS AKTIENGESELLSCHAFT 发明人 HOFACKER OLIVER;SCHAEFER MARTIN
分类号 B29C67/04 主分类号 B29C67/04
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