| 摘要 |
Provided is an adhesive sheet which reduces deficient adhesion to wafers by suppressing voids from occurring between an adhesive layer and an adhesive film, and which, even if the expansion amount and/or speed is increased, favorably expands without the adhesive film tearing. This adhesive sheet (10) wound into a roll shape comprises a rectangular release film (11), an adhesive layer (12) provided in a label form on the release film (11), and an adhesive film (13) comprising a label part (13a) which covers the adhesive layer (12) and contacts the release film (11) in the periphery of the adhesive layer (12), and a peripheral part (13b) which surrounds the outer side of the label part (13a), wherein through-holes (14) passing through the release film (11) are provided outside of an adherend-foreseen portion (15) of the adhesive layer (12), and in positions including the portion corresponding to the inside of the label part (13a). |
