SYMMETRIC PLASMA PROCESSING CHAMBER

摘要

PROBLEM TO BE SOLVED: To provide a symmetric plasma processing chamber which improves electrical and thermal symmetry of gas flow for improved plasma uniformity control.SOLUTION: A plasma processing apparatus includes: a lid assembly 110 and a chamber body 142 which enclose a process region 102; and a substrate support assembly 160 disposed in the chamber body 142. The substrate support assembly 160 includes: a pedestal base 162 disposed in a center region 156 of the chamber body 142 which is fluidically sealed from the process region 102; a lower electrode 161 supported by the pedestal base 162; and an operation assembly 163 disposed in the center region 156 and formed so as to vertically move the lower electrode 161 over a given distance.