发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a transistor having high electrical characteristics even having a fine structure with good yield; and achieve high performance, high reliability and high productivity in a semiconductor device including the transistor.SOLUTION: In a semiconductor device having a transistor including a semiconductor film, a gate insulation film and a gate electrode layer having a side wall insulation layer on lateral faces, a source electrode layer and a drain electrode layer are provided in contact with the semiconductor film and the side wall insulation layer. A manufacturing method of the semiconductor device comprises: stacking a conductive film and an oxide insulation film so as to cover the semiconductor film, the side wall insulation layer and the gate electrode layer; performing first polishing of cutting (grinding, polishing) the oxide insulation film by using an alkaline slurry; and performing second polishing of cutting (grinding, polishing) the conductive film by using an acid slurry to remove a part of the gate electrode layer and the conductive film on the gate electrode layer thereby to form the source electrode layer and the drain electrode layer.
申请公布号 JP2013211536(A) 申请公布日期 2013.10.10
申请号 JP20130035310 申请日期 2013.02.26
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 NISHIDA JIRO;TEZUKA YOSHIAKI;HANAOKA KAZUYA
分类号 H01L21/336;H01L27/08;H01L29/786 主分类号 H01L21/336
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