摘要 |
A light emitting diode ("LED") illumination device includes a substantially rigid reflector cover having a plurality of open air reflectors, a circuit board having a plurality of LED packages and a plurality of thermal vias disposed in the circuit board in the vicinity of each LED package thereby defining a pressure zone, and a mounting bracket that functions as a heat sink The base of each open air reflector is dimensioned to cover at least a portion of the pressure zone. Fasteners are used to mechanically couple the reflector cover to the circuit board and the mounting bracket and to create pressure on the thermal vias in the pressure zone. In operation, heat created from operation of the LED illumination device is effectively dissipated into the atmosphere and is simultaneously pulled away from the LED packages through the plurality of thermal vias to the mounting bracket.
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