| 摘要 |
A semiconductor package including a substrate, a semiconductor device, a protection layer, a bonding wire, and a molding compound is provided. The substrate has a contact pad and a solder mask, and the contact pad is exposed from the solder mask. The semiconductor device is disposed on the substrate. The protection layer is disposed on the contact pad. The bonding wire connects the semiconductor device to the contact pad. An end of the bonding wire penetrates the protection layer and bonds with a portion of a surface of the contact pad to form a bonding region. The protection layer covers an entire surface of the contact pad except the bonding region. The molding compound covers the semiconductor device, the contact pad, and the bonding wire.
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