PATTERN FORMING METHOD, DEVICE, AND DEVICE MANUFACTURING METHOD

摘要

Provided are a pattern forming method whereby distribution of metal particles in a formed pattern is made uniform, and manufacturing cost is reduced, a device, and a device manufacturing method. In this pattern forming method, a pattern is formed by jetting a liquid material containing a solvent and metal particles from a nozzle, and having liquid material droplets landed on a body on which the pattern is to be formed. The liquid material viscosity prior to being jetted from the nozzle is lower than the viscosity of the liquid material droplets landed on the body on which the pattern is to be formed.