EPOXY RESIN COMPOSITION, AND PREPREG AND LAMINATED BOARD COATED WITH COPPER FOIL MADE FROM SAME

摘要

The present invention relates to an epoxy resin composition, and a prepreg and a laminated board coated with a copper foil made from same. The epoxy resin composition comprises the following essential components: (A) at least one epoxy resin with a melt viscosity of not greater than 0.5 Pa.s at 150°C; and (B) a phenolic resin having the structure as shown in formula 1. In the formula, n is an integer of 0-10. The epoxy resin composition in the present invention can provide the prepreg and laminated board coated with a copper foil made thereform with a high glass transition temperature, high heat endurance, low expansion coefficient, low hygroscopicity, and can meet the requirements on high reliability in high multilayer printed circuit boards.