| 摘要 |
<p>The purpose of the present invention is to provide an image pickup device, which has improved heat dissipating performance, while reducing the dimensions thereof. This image pickup device is provided with: a housing, which supports a lens section that forms an image in an image pickup element with light transmitted from a subject; a plurality of substrates, which have mounted thereon a plurality of electronic components, and which are disposed inside of the housing at intervals; a wiring member, which has flexibility, and which electrically connects the substrates to each other; and a holding member, which has elasticity in the disposing direction of the substrates, and which holds the substrates, which are in contact with the holding member, by pressing the substrates to the housing side by being provided in a compressed state between the adjacent substrates. The holding member has heat conductivity, and transfers heat from the substrate held by the holding member to the housing by having at least a part of the outer circumferential end of the holding member in contact with the housing.</p> |
