| 摘要 |
PURPOSE: A semiconductor module is provided to prevent a first semiconductor package substrate from being bent by mounting a first semiconductor package on a package substrate. CONSTITUTION: A semiconductor package is mounted on a second package substrate (12). The semiconductor package is electrically connected to the second package substrate. A semiconductor bare chip is mounted on the semiconductor package. The semiconductor bare chip is electrically connected to the second package substrate by wire bonding. A heat sink (16) is mounted on the semiconductor bare chip. |
