COPPER PASTE COMPOSITION FOR PRINTING AND THE FORMING METHOD FOR METAL PATTERN USING THE SAME
摘要
PURPOSE: A copper paste composition for printing has excellent electric conductivity by preventing oxidation and making simultaneous hot air drying and sintering possible. CONSTITUTION: A copper paste composition for printing comprises 50-90 wt% of a copper having amine remaining on the surface of the powder; 0.5-5 wt% of a binder resin; 5-40 wt% of a solvent; and 0.1-10 wt% of a silane coupling agent. The copper powder consists of copper nanoparticle with an average particle diameter of 40-500 nm. A forming method of a metal pattern comprises a step for simultaneously drying with hot air and sintering the copper paste composition by using nitrogen gas at 150-500°C after printing the copper paste composition on a substrate.
申请公布号
KR20130110389(A)
申请公布日期
2013.10.10
申请号
KR20120032325
申请日期
2012.03.29
申请人
DONGJIN SEMICHEM CO., LTD.
发明人
KIM, SEONG BAE;LEE, SEUNG HYUK;LEE, SUNG HYUN;YOO, HYUN SEOK;YU, KWAN TAE;HAN, JU KYUNG