| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board on an interlayer connection section of which it is difficult to form a residual film.SOLUTION: A multilayer wiring board manufacturing method has: a step of preparing an imprint mold 1 having a printing plate 11 on which protrusions 11V, 12V are formed, and preparing a first wiring board 101 on which a wiring including a land L is formed; a step of forming a conductive convex-like member 30 on the land L; a step of laminating a second insulative sheet 22 on the first wiring board 101; a step of opposing tips of the protrusions 11V, 12V to the conductive convex-like member 30, and pressing the imprint mold 1 to the second insulative sheet 22 so that the tips of the protrusions 11V, 12V penetrate through the second insulative sheet 22 and are in contact with or embedded in the conductive convex-like member 30; a step of releasing the imprint mold 1 from the hardened second insulative sheet 22; and a step of filling groove sections 201a-213a of the second insulative sheet 22 with a conductive material P3. |
