发明名称 |
CONTACT AND BONDING STRUCTURE OF THE CONTACT |
摘要 |
A contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact includes a main body; a movable portion held by the main body so as to be reciprocal in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion, and a soldering portion.
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申请公布号 |
US2013264098(A1) |
申请公布日期 |
2013.10.10 |
申请号 |
US201113520246 |
申请日期 |
2011.11.04 |
申请人 |
KITANO HIROKI;YUMI HIDEO;NAKAMURA TATSUYA;KITAGAWA INDUSTRIES CO., LTD. |
发明人 |
KITANO HIROKI;YUMI HIDEO;NAKAMURA TATSUYA |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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