发明名称 CONTACT AND BONDING STRUCTURE OF THE CONTACT
摘要 A contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact includes a main body; a movable portion held by the main body so as to be reciprocal in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion, and a soldering portion.
申请公布号 US2013264098(A1) 申请公布日期 2013.10.10
申请号 US201113520246 申请日期 2011.11.04
申请人 KITANO HIROKI;YUMI HIDEO;NAKAMURA TATSUYA;KITAGAWA INDUSTRIES CO., LTD. 发明人 KITANO HIROKI;YUMI HIDEO;NAKAMURA TATSUYA
分类号 H05K1/02 主分类号 H05K1/02
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