METHOD AND APPARATUS TO FABRICATE VIAS IN SUBSTRATES FOR GALLIUM NITRIDE MMICS

摘要

A system for fabricating vias in SiC and CVD diamond substrates through controlled laser ablation using short pulse lengths and short wavelengths. It involves the use of lasers that have a short pulse length at a short wavelength to ablate material without undue heating or damage to the surrounding areas and with desired depth control.