| 摘要 |
<p>Wiring (2, 3) is furnished on the upper surface of a laminated ceramic substrate (1). A ceramic block (6) is furnished on the laminated ceramic substrate (1). A plurality of electronic components, including a semiconductor laser (7), are furnished on the surface of the ceramic block (6). Wiring (11, 12) furnished on the surface of the ceramic block (6) connects some of the plurality of electronic components to the wiring (2, 3). A metal cap (16) outfitted with a glass window (15) is furnished on the laminated ceramic substrate (1), and this metal ring (14) covers the ceramic block (6) and the plurality of electronic components such as the semiconductor laser (7).</p> |
