SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

摘要

PURPOSE: A substrate processing apparatus and a substrate processing method are provided to improve the temperature uniformity of a substrate by preventing the temperature of the substrate from being decreased due to evaporation heat. CONSTITUTION: A processing solution supply unit (3,4) supplies a processing solution to the center of the main surface of a substrate. A substrate rotating device (5) rotates the substrate with a substrate holding unit. A chamber (7) receives the substrate holding unit therein. A pressure changing unit changes the internal pressure of the chamber. A control unit (11) controls the processing solution supply unit, the substrate rotating device, and the pressure changing unit. [Reference numerals] (11) Control unit