<p>A method of processing a semiconductor wafer (30) having a peripheral portion (20) includes providing external support structure (50, 60) and restraining radially inward displacement of the wafer peripheral portion with the external support structure.</p>
申请公布号
WO2013152296(A1)
申请公布日期
2013.10.10
申请号
WO2013US35462
申请日期
2013.04.05
申请人
TEXAS INSTRUMENTS INCORPORATED;TEXAS INSTRUMENTS JAPAN LIMITED
