| 摘要 |
FIELD: heating.SUBSTANCE: heat dissipation device for heat-radiating electric component (10) includes heat-radiating electric component (10) arranged on printed-circuit board (20) in thermal contact with heat-conducting layer (23) of printed-circuit board (PCB). Heat-conducting installation element (40) is attached to heat-conducting layer (23) by soldering and has connecting part (43) having the possibility of being engaged with cavity (31) in radiator (30); thus, providing attachment of PCB (20) to radiator (30); at that, thermal contact is provided from heat-radiating electric component (10) through heat-conducting layer (23) and installation element (40) to radiator (30). As a result of application of a heat-conducting installation element, there can be achieved heat dissipation with PCB equipped with one heat-conducting layer, and not multilayered PCB that is required in devices of previous level of technologies.EFFECT: providing economically efficient device providing effective heat dissipation, simplifying installation and dismantling, and preventing deformation caused with differences in thermal expansion coefficient.9 cl, 5 dwg |
