| 摘要 |
PROBLEM TO BE SOLVED: To provide improved systems and methods for external frit mounted components on a sensor device.SOLUTION: In one embodiment, a method for fabricating a sensor device comprises: securing at least one component stack, which comprises a plurality of components, on a sensor body over at least one opening in the sensor body; and applying a frit to the plurality of components in the at least one component stack and the sensor body. The method further comprises: heating the frit, the at least one component stack, and the sensor body so that the frit melts; and cooling the frit, the at least one component stack, and the sensor body so that the at least one component stack is secured to the sensor body. |
