| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition suitable for semiconductor encapsulation, which is excellent in storage stability, work efficiency, low moisture absorption, mechanical strength, heat discoloration resistance and light discoloration resistance, and which has a low linear expansion coefficient and also high crack resistance.SOLUTION: A curable resin composition contains the following (A) to (C) components as essential components: (A) a terminal isocyanuric group-containing epoxy resin expressed by formula (1), obtained by reacting a compound (A1) in which the average number of carbons in Ris 20 or more, and a terminal group is composed of saturated alicyclic dicarboxylic acid group, with a triglycidyl isocyanurate (A2) at a carboxy group/epoxy group (molar ratio)=1/3 to 1/10, (B) a curing agent, and (C) a curing accelerator. (In the formula, Z is a saturated alicyclic group with C4 to C12; and Ris a hydrocarbon group of C20 or more expressed by formula (2)). |
