发明名称 Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIALS AND MANUFACTURING METHOD THEREOF
摘要 Cu-Ni-Si-Co copper alloy strip having excellent balance between strength and electrical conductivity which can prevent the drooping curl is provided. The copper alloy strip for an electronic materials contains 1.0-2.5% by mass of Ni, 0.5-2.5% by mass of Co, 0.3-1.2% by mass of Si, and the remainder comprising Cu and unavoidable impurities, wherein the copper alloy strip satisfies both of the following (a) and (b) as determined by means of X-ray diffraction pole figure measurement based on a rolled surface: (a) among a diffraction peak intensities obtained by beta scanning at alpha=20° in a {200} pole figure, a peak height at beta angle 145° is not more than 5.2 times that of standard copper powder; (b) among a diffraction peak intensities obtained by beta scanning at alpha=75° in a {111} pole figure, a peak height at beta angle 185° is not less than 3.4 times that of standard copper powder.
申请公布号 US2013263978(A1) 申请公布日期 2013.10.10
申请号 US201113993648 申请日期 2011.11.11
申请人 KUWAGAKI HIROSHI;JX NIPPON MINING & METALS CORPORATION 发明人 KUWAGAKI HIROSHI
分类号 H01B1/02;C22F1/08 主分类号 H01B1/02
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