| 发明名称 |
POLISHING SLURRY COMPOSITION |
| 摘要 |
Provided is a polishing slurry composition, including a non-ionic surfactant represented by the following formula (1) R-(OCH2CH2)x-OH formula (1) wherein x is an integer from 1 to 50. |
| 申请公布号 |
US2013264515(A1) |
申请公布日期 |
2013.10.10 |
| 申请号 |
US201213568130 |
申请日期 |
2012.08.07 |
| 申请人 |
CHEN WEI-JUNG;TSAI WEN-TSAI;WU HO-YING;CHANG SONG-YUAN;LU MING-HUI;UWIZ TECHNOLOGY CO., LTD. |
发明人 |
CHEN WEI-JUNG;TSAI WEN-TSAI;WU HO-YING;CHANG SONG-YUAN;LU MING-HUI |
| 分类号 |
C09K13/00;C07C43/13 |
主分类号 |
C09K13/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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