| 摘要 |
FIELD: measurement equipment.SUBSTANCE: device for monitoring of thickness of conducting film of items belonging to electronic equipment immediately in a technological process of its formation in vacuum by measuring electric resistance includes a substrate from dielectric or semiconducting material, metal contact platforms made on opposite ends of the above substrate on its face side to provide connection to a measuring instrument and the specified conducting film. Each metal contact platform of the device is two-layered and made in the form of a stepped structure on the side that is opposite to the end of the above substrate. The first layer of metal contact platform, which is located immediately on the above substrate, has thickness exceeding the thickness of the specified conducting film by 1-2 times, and the second one with thickness of (0.5÷1)×10m; displacement in horizontal plane of the second layer of stepped structure relative to the first one towards the corresponding end of the above substrate is determined from a certain expression. The specified conducting film is made immediately on face side of both metal contact platforms and free part of the above substrate between them, which is identical to monitored conducting film on working substrates of items.EFFECT: improving accuracy and repeatability.8 cl, 1 dwg, 1 tbl |
