发明名称 CIRCUIT CONNECTION MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a circuit connection material capable of achieving good electrical connection between respective circuit electrodes, and also capable of fully enhancing long term reliability of electric characteristics between circuit electrodes; and a connection structure of circuit members and connection method of circuit members using the material.SOLUTION: This circuit connection material 10 includes an adhesive composition and a conductive particle, where the conductive particle 12 has a projection 14 comprising one, or two or more metal layers 22 on a nucleus 21, the metal layer 22 is formed at least on the surface of the projection 14, the metal layer 22 is composed of nickel or a nickel alloy, and the compressive elastic modulus of the conductive particle 12 at 20% compression is 100-800 kgf/mm.
申请公布号 JP2013209648(A) 申请公布日期 2013.10.10
申请号 JP20130055002 申请日期 2013.03.18
申请人 HITACHI CHEMICAL CO LTD 发明人 TOMISAKA KATSUHIKO;KOBAYASHI KOJI;TAKETAZU JUN;ARIFUKU MASAHIRO;KOJIMA KAZUYOSHI;MOCHIZUKI AKIOMI
分类号 C09J201/00;C09J9/02;C09J11/04;C09J11/06;C09J163/00;H01B1/00;H01B1/22;H01R4/04 主分类号 C09J201/00
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