发明名称 |
METHOD FOR PRODUCING LAMINATED ELECTRONIC COMPONENT, AND LAMINATED ELECTRONIC COMPONENT |
摘要 |
A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate. |
申请公布号 |
US2013266758(A2) |
申请公布日期 |
2013.10.10 |
申请号 |
US201113811167 |
申请日期 |
2011.07.21 |
申请人 |
KIMURA KAZUNARI;TABATA MISAKI;TOMAKI SHIGEMITSU;NAKAMURA AKIRA;ABE ISAO;SAITO NORIYUKI;TDK CORPORATION |
发明人 |
KIMURA KAZUNARI;TABATA MISAKI;TOMAKI SHIGEMITSU;NAKAMURA AKIRA;ABE ISAO;SAITO NORIYUKI |
分类号 |
B32B38/00;B32B5/00;B32B18/00 |
主分类号 |
B32B38/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|