| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of forming an arbitrary contamination pattern on a substrate.SOLUTION: The substrate processing apparatus manufactures a contaminated substrate W to which contaminant is stuck. The substrate processing apparatus includes an application nozzle 75 for applying a contamination solution containing contaminant to a partial area of the substrate W, a drive mechanism D71 and a drive mechanism D72 for relatively moving the substrate W and the application nozzle 75, and a control device. The control device controls the application nozzle 75, the drive mechanism D71 and the drive mechanism D72 on the basis of regulation information for regulating a position of the substrate W to which the contamination solution is to be applied. Consequently, the control device applies the contamination solution to the position of the substrate W regulated by the regulation information by using the application nozzle 75. |
