| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component with further improved insulation property.SOLUTION: An electronic component is formed of: a semiconductor chip 1; two lead frames 2 and 3 electrically connected to the semiconductor chip 1; a mold resin 4 sealing connected portions of the semiconductor chip 1 with the lead frames 2 and 3; an insulating sheet 5 having a surface contact with one of the lead frames 2 and 3; and a metal sheet 6 laminated on a surface of the insulating sheet 5 on a side opposite to the lead frame surface contact side. Materials of both of the insulating sheet 5 and the mold resin 4 are held in a non-migrated state. |
