发明名称 VACUUM-MOLDED PACKAGING OF PRODUCT PLACED ON SUBSTRATE INTO CLOSE-FITTING FILM
摘要 FIELD: packaging industry.SUBSTANCE: in the machine the product is packaged that is placed on a substrate having in the sidewall at least one opening. The machine comprises a first film-feeding plate for holding the film sheet, its heating, moving into position over the substrate with the product and sealing connection with the substrate and a vacuum device for removing air from the substrate on the bottom of the sheet through the opening in the side wall. At that the plate is made with the ability to separate the sheet from the plate for its retraction in the substrate while the vacuum device removes air from the substrate. In the method of vacuum-moulded packaging of product on the substrate with at least one opening in its side wall, a sheet of film is used that is held by the first film-feeding plate, it is heated, moved to a position above the substrate with the product and hermetically connected with the substrate. Then, the air is removed from the substrate on the bottom of the sheet through the opening. At that, during removal of air the sheet is separated from the plate allowing retracting the sheet into the substrate.EFFECT: group of inventions provides reduction of film consumption, quality improvement and simplification.15 cl, 22 dwg
申请公布号 RU2494935(C1) 申请公布日期 2013.10.10
申请号 RU20120105423 申请日期 2010.07.28
申请人 KRIOVAK, INK. 发明人 PALUMBO RIKKARDO;RIZZI DZHVANO
分类号 B65B31/02;B65B7/16 主分类号 B65B31/02
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