| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having a balance in metal foil adhesion, heat resistance, moisture resistance, flame retardancy, heat resistance with metals, specific dielectric constant, and dielectric tangent, and a prepreg using the same and a stacked plate.SOLUTION: A thermosetting resin composition includes (A) a metal salt of a two-substituted phosphinic acid, (B) a maleimide compound having an N-substituted maleimide group in the molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin that contains at least two epoxy groups in one molecule. There are provided a prepreg and a stacked plate, using the composition. |
