| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat curable resin composition excellent in curability and heat resistance.SOLUTION: A heat curable resin composition includes: (a-1) a compound expressed by Si-(OR)(R)or its polymer; a mixture of (a-1) the compound expressed by Si-(OR)(R)or its polymer and at least one of (a-2) a polydimethylsiloxane, a polymethylphenylsiloxane and a polydiphenylsiloxane having a hydroxy group at its terminal; or at least one of (a') a polydimethylsiloxane of which terminal is partially silicate-modified, a polymethylphenylsiloxane of which terminal is partially silicate-modified and a polydiphenylsiloxane of which terminal is partially silicate-modified, and has a ≤1.07 ratio of peak intensity at near 1,100 cmby IR to the peak intensity at near 1,020 cm[wherein, R's are each independently alkyl: and n's are each independently an integer of 1 to 4]. |
