发明名称 INTEGRATED CAVITY IN PCB PRESSURE SENSOR
摘要 PROBLEM TO BE SOLVED: To provide a pressure sensor, and more specifically, a PCB pressure sensor.SOLUTION: An integrated pressure sensor assembly 100 comprises: a printed circuit board assembly 155 comprising a plurality of boards; a pressure die mounted on at least a portion of the printed circuit board assembly; and a housing 150 engaged with the printed circuit board assembly. The printed circuit board assembly includes at least one pressure transmission channel and at least one electrical transmission channel. Preferably, the printed circuit board assembly comprises a bottom board, a top board, and at least one center board disposed between the top and bottom boards.
申请公布号 JP2013210389(A) 申请公布日期 2013.10.10
申请号 JP20130122449 申请日期 2013.06.11
申请人 CUSTOM SENSORS & TECHNOLOGIES INC 发明人
分类号 G01L19/14 主分类号 G01L19/14
代理机构 代理人
主权项
地址