发明名称 FILM TRANSFER METHOD AND APPEARANCE MEMBER MANUFACTURED BY USING THE SAME
摘要 A film transfer method is provided and includes the following steps: A mold apparatus is provided. In a mold cavity of the mold apparatus, a film substrate having a three-dimensional texture layer is provided. A melted plastic is injected into the mold cavity, such that the melted plastic covers the three-dimensional texture layer of the film substrate. The melted plastic is solidified. The solidified plastic is separated from the three-dimensional texture layer of the film substrate.
申请公布号 US2013264727(A1) 申请公布日期 2013.10.10
申请号 US201313798146 申请日期 2013.03.13
申请人 COMPAL ELECTRONICS, INC. 发明人 LEE JIH-HOUNG;PENG MING-CHUNG
分类号 B29D11/00;B29C45/02;B29C45/40 主分类号 B29D11/00
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