发明名称 |
FILM TRANSFER METHOD AND APPEARANCE MEMBER MANUFACTURED BY USING THE SAME |
摘要 |
A film transfer method is provided and includes the following steps: A mold apparatus is provided. In a mold cavity of the mold apparatus, a film substrate having a three-dimensional texture layer is provided. A melted plastic is injected into the mold cavity, such that the melted plastic covers the three-dimensional texture layer of the film substrate. The melted plastic is solidified. The solidified plastic is separated from the three-dimensional texture layer of the film substrate.
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申请公布号 |
US2013264727(A1) |
申请公布日期 |
2013.10.10 |
申请号 |
US201313798146 |
申请日期 |
2013.03.13 |
申请人 |
COMPAL ELECTRONICS, INC. |
发明人 |
LEE JIH-HOUNG;PENG MING-CHUNG |
分类号 |
B29D11/00;B29C45/02;B29C45/40 |
主分类号 |
B29D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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