METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE STRUCTURE

摘要

The present disclosure relates to a method for manufacturing a semiconductor device structure, comprising the steps of: fixing the position of a semiconductor device on top of a plate, wherein the semiconductor device is a chip-type semiconductor light-emitting device, and the positions of two electrodes of the semiconductor device are fixed so as to face the plate (a perpendicular direction is defined as perpendicularly upward from, and a horizontal direction is defined as horizontal to the path of a light generated from the semiconductor light-emitting device); and covering the semiconductor device with an encapsulation material, wherein a step of forming a light path alteration surface on at least one outer surface of the encapsulation material is included before or after a step of separating.